HYBRID EPOXY

Hybrid epoxy is designed for use in the assembly of temperature sensitive electronic components.
This product is formulated to temporarily cure when exposed to UV light, followed with a secondary thermal cure at low temperature.
Temporarily curing the material allows for any necessary adjustments to the final device configuration. 

Depending on applications and customer’s demands, It can be developed and customized.

EX)

Various electrical and electronic components such as automotive and mobile camera, PCB, holder, lens, etc.

We can respond faster if you contact us about the type of product you want.

<POLYTECH CATALOG>

Product
Viscosity
(CPS)
T.I Hard
ness
Tg
(℃)
Cure Condition 비고
PT-052DBM 18,000
(C&P)
3.3 70 102 UV 365-405nm 3,000mJ
+ 30min @80℃
Convection oven
PT-054DBM 30,000
(C&P)
3.5 75 105 UV 365-405nm 3,000mJ
+ 30min @80℃
Convection oven
PT-383DBL 23,000
(C&P)
3 D70 100 UV 365-405nm 3,000mJ
+ 30min @80℃
Convection oven